BOPP PET PE CPP PVC镀铝膜及反光布在食品包装行业的重要作用

sputtering depositionThe first to appear is simple DC diode sputtering, which has the advantage of simple device, but the deposition rate of DC diode sputtering is low; To maintain self-sustaining discharge, it cannot be carried out at low pressure (<0.1 Pa); The drawbacks of not being able to sputter insulating materials limit its application. Adding a hot cathode and an auxiliary anode to a DC bipolar sputtering device constitutes DC triode sputtering. The increased hot cathode and auxiliary anode generate hot electrons that enhance the ionization of sputtered gas atoms, allowing sputtering to occur even at low pressures; In addition, the sputtering voltage can be reduced to allow sputtering to occur at low pressure and low voltage; At the same time, the discharge current also increases and can be independently controlled without being affected by voltage. Adding an electrode (grid like structure) in front of the hot cathode to form a quadrupole sputtering device can stabilize the discharge. However, these devices have difficulty obtaining plasma regions with high concentrations and low deposition rates, thus they have not been widely used in industry.

Magnetron sputtering is a development based on bipolar sputtering, which establishes a magnetic field orthogonal to the electric field on the surface of the target material, solving the problems of low deposition rate and low plasma ionization rate in bipolar sputtering, and has become one of the main methods in the current coating industry. Compared with other coating technologies, magnetron sputtering has the following characteristics: a wide range of materials can be used to prepare targets, almost all metals, alloys, and ceramic materials can be made into target materials; Under appropriate conditions, the co sputtering method of multiple target materials can deposit alloys with a constant ratio; By adding oxygen, nitrogen, or other active gases to the sputtering discharge atmosphere, a compound film of target material and gas molecules can be deposited; By controlling the sputtering coating process, it is easy to obtain uniform and high-precision film thickness; By ion sputtering, the material of the target material is directly transformed from a solid state to a plasma state, and the installation of the sputtering target is not limited, making it suitable for multi target layout design in large volume coating chambers; Sputtering coating has the characteristics of fast coating speed, dense film layer, and good adhesion, making it very suitable for large-scale industrial production. in recent yearsApplied FilmThe development is rapid, and representative methods include radio frequency sputtering, reactive magnetron sputtering, non-equilibrium magnetron sputtering, pulsed magnetron sputtering, high-speed sputtering, etc.