Thermal pad, ultra-high thermal conductivity material, carbon fiber thermal pad, application of carbon fiber thermal pad in the chip industry

Thermal pad, ultra-high thermal conductivity material, carbon fiber thermal pad, carbon fiber thermal padWith the improvement of the performance and functionality of electronic devices, the heat generated by each device increases, and it is important to effectively dissipate, dissipate, and cool the heat. For high-performance mobile products such as 5G smartphones and AR/VR devices, the installation space of heat dissipation components is limited due to the use of high-performance ICs and highly integrated designs that pursue weight reduction. The installation space inside the shell is limited, so TIM technology solutions such as high thermal conductivity gaskets are used to better achieve heat dissipation.

1、 What is a thermal pad?

Thermal pads are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics make them suitable for covering very uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion board, thereby improving the efficiency and service life of the heat generating electronic components. The thermal pad is installed between the heat dissipation cold plate and the heating chip, which conducts the heat generated by the chip to the heat dissipation cold plate, thereby reducing the temperature of the chip. When the thermal pad is compressed, it will generate compressive stress, which increases with the increase of compression amount. When selecting the thermal pad, it should be noted that the compressive stress during compression should not be greater than the required pressure of the heating chip, otherwise it will cause damage to the chip.

2、 What is carbon fiber thermal pad?