One article explains in detail the application of low-temperature cured conductive silver paste, conductive copper paste, sintered copper paste, and copper paste in circuit boards

Yang low-temperature curing conductive silver paste, conductive copper paste, sintered copper paste, copper paste manufacturer's special wholesale price

XJY-gs053 Sheet Silver Copper Powder Product Technical Parameters

Technical Data Sheet

（1） Product performance and features:

Silver coated copper powder introduces advanced chemical plating technology from abroad, forming silver coatings of different thicknesses on the surface of ultrafine copper powder. It not only overcomes the defect of copper powder being prone to oxidation, but also solves the problems of expensive silver powder and easy migration. It is a very promising method for developmentHighly conductive materialIt is an ideal cost-effective substitute for silver with copperConductive powder.

（2） Product Introduction:

Silver bag copper powderIt can be widely applied in the fields of conductivity and electromagnetic shielding in various industries such as electronics, mechatronics, communication, printing, aerospace, and military. Products such as computers, mobile phones, integrated circuits, various electrical appliances, electronic medical equipment, electronic instruments, etc. are not affected by electromagnetic wave interference, while reducing the harm of electromagnetic radiation to the human body. In addition, conductive treatment of insulators such as colloids and circuit boards ensures that insulated objects have good conductivity.

This product adoptsCyanide free chemical plating processDeveloped a silver plated copper powder with good conductivity and strong anti migration ability (nearly 100 times higher than ordinary silver powder conductive coatings)

（3） Product Technical Parameters: YF-gs053：

1) Appearance: Meat red

2) Particle shape: fragmented state

3) Loose density: 1.2-1.3 g/cm3

4) Seismic density: 2.4-2.6 g/cm3

5) Particle size: 14-16un

6) Silver content 3% (positive or negative value 0.5%)

（5） Usage:

1. Cut open the plastic packaging and pour out the powder.

2. Mix with solvent for dispersion treatment. Mixing equipment can be used for dispersion. (Surface treatment agents can also be added to modify the surface of the powder)

3. Add the carrier mixture. If the viscosity is high, it is recommended to use a three roll rolling mill for mixing. The spacing between the rolling mill rollers should be set between 3-5 times the particle size of the powder to prevent the rolling mill from damaging the surface coating of the powder. If the viscosity is low, a stirrer or emulsifier can be directly used for stirring and dispersion.

（6） Attention:

1. If the viscosity of the mixed colloid is too high, it is necessary to adjust the ratio of powder to resin. Reduce the proportion of powder in the resin to lower viscosity. Or contact us to provide powder samples with lower oil absorption values. If the viscosity is too low, the proportion of powder in the resin can be increased to adjust the viscosity. You can also contact us to provide samples with higher oil absorption values.

2. If you encounter situations where the antioxidant capacity cannot meet the requirements, please contact us to propose your testing standards and provide you with products with appropriate antioxidant levels.

（7） Packaging, storage and transportation:

1. Packaging specification: 5kg/pack

2. The product should be stored in a cool and ventilated place, away from sources of fire and heat. The storage period is two years.

3. This product is non hazardous and is transported as a general chemical.