Testing method and technical standard for heat resistance of PI copper plated film

PI (polyimide) copper plated film, as a high-performance composite material, has been widely used in flexible electronics, microelectronic packaging, new energy and other fields due to its excellent heat resistance, conductivity, mechanical strength and electrical insulation. However, in order to ensure its stable performance in high temperature environments, it is particularly important to conduct heat resistance tests on PI copper plated films and develop technical standards. This article will provide a detailed introductionPI copper plated filmMethods and technical standards for heat resistance testing.

1、 Test method for heat resistance of PI copper plated film

1. Thermal stability test

   • Testing principle: Place the PI copper plated film in a high temperature environment and observe its performance changes.
   • Test steps: Set different temperature ranges (such as 100 ° C to 200 ° C), test and record the changes in performance parameters such as conductivity and adhesion of PI copper plating film at each temperature.
   • Evaluation criteria: Based on the test results, analyze the performance stability of PI copper plated film at different temperatures and evaluate its heat resistance.

2. Oxidation test

   • Testing principle: Copper is prone to react with oxygen in the air at high temperatures, producing substances such as copper oxide, which can cause color changes. Evaluate the stability of PI copper plated film by observing its oxidation under high temperature environment.
   • Test steps: Heat the PI copper plated film at a specific temperature for a long time and observe whether there is copper oxide generated on its surface.
   • Evaluation criteria: Record the time and quantity of copper oxide generation, and evaluate the antioxidant performance of PI copper plating film.

3. Combined force testing

   • Testing principle: Under high temperature conditions, the bonding force between the PI film and the copper layer may change, affecting the overall performance of the PI copper plated film.
   • Testing steps: Evaluate through methods such as tensile testing, peel testing, etcPI copper plated filmStability of adhesion under high temperature conditions.
   • Evaluation criteria: Record the degree of decrease in adhesion and evaluate its impact on the overall performance of PI copper plating film.

4. Performance parameter monitoring

   • Testing principle: Regularly measure key performance parameters such as conductivity, resistivity, and adhesion of PI copper plated film in a high-temperature environment to evaluate its stability.
   • Test steps: Measure the performance parameters of PI copper plating film at different temperatures and time points, record the data, and analyze it.
   • Evaluation criteria: Evaluate the heat resistance of PI copper plated film by comparing and analyzing the changes in performance parameters at different temperatures.

5. Accelerated aging test

   • Testing principle: By increasing the testing temperature or extending the testing time, simulate the aging process of PI copper plating film during long-term use, and evaluate its heat resistance and service life.
   • Test steps: Set a high temperature environment and conduct a long-term aging test on the PI copper plating film, observe and record its performance changes.
   • Evaluation criteria: Evaluate the impact of aging on the performance of PI copper plating film (such as appearance, mechanical properties, electrical properties, etc.), and determine its service life.

2、 Technical standard for heat resistance of PI copper plated film

1. Substrate selection: Choose high heat resistance PI film as the substrate to ensure its stable performance in high temperature environments.
2. Copper plating process: Optimize copper plating conditions, including temperature, current density, plating solution composition, and other parameters, to obtain a copper layer with stronger and more uniform adhesion.
3. Surface treatment: Properly treat the surface of the PI film, such as plasma treatment, chemical etching, etc., to increase its roughness and activity, and improve its adhesion with the copper layer.
4. Coating protection: Apply a special protective layer material, such as alumina coating, organic coating, etc., on the surface of PI copper plated film to further improve its heat resistance and oxidation resistance.
5. Performance testing: According to the above testing method, conduct heat resistance testing on the PI copper plated film to ensure that it meets relevant technical standards and application requirements.

in summary,PI copper plated filmThe heat resistance testing method and technical standards are key to ensuring its stability and application effectiveness. Through scientific and reasonable testing methods and strict technical standards, the heat resistance of PI copper plating film can be evaluated, providing strong guarantees for its application in various fields.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.