Technical solution to solve the performance degradation of PI silver plated film in high temperature environment

summary

PI silver plated film has been widely used in multiple high-tech fields due to its excellent conductivity and good mechanical properties. However, in high-temperature environments,PI silver plated filmThe performance may deteriorate due to the oxidation and diffusion of the silver layer at high temperatures. This article explores the performance changes of PI silver plated film under high temperature environment through experimental data, and proposes some effective solutions.

Experimental Materials and Methods

The PI silver plated film used in this experiment is composed ofAdvanced Institute (Shenzhen) Technology Co., LtdThe experiment aims to evaluate the performance changes of PI silver plated film under different temperature conditions and explore technical means to prevent performance degradation. The experimental materials include standard sized PI silver plated film samples, all of which undergo standard surface treatment to remove oil stains and other impurities before the experiment.

Experimental Design and Implementation

In order to study the performance changes of PI silver plated film under high temperature environment, we set four different temperature groups for aging treatment, namely: room temperature (25 ° C), 80 ° C, 120 ° C, and 180 ° C. Under each temperature group, the PI silver plated film samples were aged in the corresponding constant temperature chamber for 24 hours and then subjected to performance testing.

Experimental results and analysis

Conductivity testing

By studying different temperature groupsPI silver plated filmIn the conductivity test, we found that with the increase of temperature, the conductivity showed a significant downward trend. The specific data is as follows:

• Room temperature (25 ° C): resistivity of 0.02 Ω/□;
• 80 ° C: resistivity rises to 0.04 Ω/□;
• 120 ° C: The resistivity further increases to 0.08 Ω/□;
• 180 ° C: The resistivity increases significantly to 0.2 Ω/□.

From the data, it can be seen that the conductivity of PI silver plated film significantly decreases when the temperature reaches 180 ° C. This is mainly due to the oxidation reaction of the silver layer at high temperatures, which damages the conductive path between silver particles.

Mechanical performance testing

In terms of mechanical performance testing, we also observed a decreasing trend in the tensile strength and elongation at break of PI silver plated film with increasing temperature. The specific data is as follows:

• Room temperature (25 ° C): Tensile strength of 40MPa, elongation at break of 100%;
• 80 ° C: The tensile strength drops to 35MPa, and the elongation at break is 80%;
• 120 ° C: The tensile strength further decreases to 30MPa, and the elongation at break is 60%;
• 180 ° C: The tensile strength significantly decreases to 20MPa, and the elongation at break is 40%.

This indicates that high temperature environments not only affectPI silver plated filmThe conductivity of the material can also have adverse effects on its mechanical properties.

Solution

To address the issue of performance degradation of PI silver plated film in high-temperature environments, we can adopt the following solutions:

1. Adding antioxidants: Adding an appropriate amount of antioxidants during the preparation process of PI silver plating film can effectively delay the oxidation process of the silver layer. The experiment showed that after adding antioxidants, the electrical resistivity of PI silver plated film only increased to 0.1 Ω/□ under 180 ° C conditions, which was significantly improved compared to the situation without adding antioxidants.

2. Surface modification treatment: Through surface modification techniques such as plasma treatment or electroless nickel plating, a protective film can be formed on the surface of the PI silver plating film to prevent direct contact between oxygen and the silver layer, thereby reducing the occurrence of oxidation reactions. The experimental results show that the PI silver plated film after surface modification treatment can still maintain a resistivity of 0.05 Ω/□ at 180 ° C.

3. Optimizing silver plating process: By optimizing the silver plating process, such as improving the density and uniformity of the silver plating layer, the high temperature resistance of the silver layer can be enhanced. The experiment found that the PI silver plated film prepared by the improved silver plating process has a resistivity of only 0.08 Ω/□ under the same high temperature conditions.

conclusion

From the above experimental data, it can be seen that,PI silver plated filmThe problem of performance degradation does occur in high-temperature environments, but it can be effectively alleviated by adding antioxidants, surface modification treatments, and optimizing silver plating processes. It is recommended to choose a suitable solution based on the specific working environment in practical applications to ensure the stable and reliable performance of PI silver plated film.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.