With the continuous development of electronic technology,
Flexible electronic materialsThe demand is increasing day by day. PEN (polyethylene naphthalate) film has become one of the important substrates in the field of flexible electronics due to its excellent mechanical properties, thermal stability, and optical transparency. As a common conductive coating, nickel plating can significantly enhance the conductivity of PEN films, making them widely applicable in electronic devices, sensors, and flexible circuits. This article will explore the conductivity and influencing factors of nickel plating on PEN thin films, and analyze them in conjunction with the research results of Advanced Institute (Shenzhen) Technology Co., Ltd.
1、 Conductivity of PEN film nickel plating layer
PEN film itself is an insulating material, but by coating its surface with a layer of nickel, it can be endowed with good conductivity. Nickel is a metal with high conductivity and good oxidation resistance, and the continuous conductive layer formed on the surface of PEN film can effectively conduct current. According to the research of Advanced Institute (Shenzhen) Technology Co., Ltd,
PEN nickel plating filmThe conductivity of the material is mainly reflected in the following aspects:
-
Low resistivity: The resistivity of nickel is relatively low (about 7.84 × 10 ⁻⁸Ω· m), so the nickel plated PEN film can achieve lower surface resistance. In practical applications, this low resistance characteristic enables PEN nickel plating film to efficiently conduct current, meeting the conductivity requirements of flexible electronic devices.
-
Good adhesion: By optimizing the coating process, the nickel layer can form a good adhesion with the PEN film, ensuring that the conductive layer can remain stable under mechanical bending, stretching, and other operations. This stability is crucial for the long-term use of flexible electronic devices.
-
Oxidation resistance: The nickel layer can effectively protect the PEN film from environmental factors and also has good oxidation resistance, ensuring the long-term stability of its conductivity.
2、 Factors affecting the conductivity of nickel plating on PEN film
（1） Coating thickness
The thickness of the nickel plating layer is one of the key factors affecting the conductivity performance. According to the research of Advanced Institute (Shenzhen) Technology Co., Ltd., the thickness of the coating is inversely proportional to the surface resistance. Thicker coatings can provide lower resistance, but they also increase material costs and process complexity. Therefore, a balance needs to be found between conductivity and cost. Generally speaking, a coating thickness between 1-5 microns can better meet the requirements of flexible electronic devices.
（2） Coating process
The coating process has a significant impact on the conductivity performance. Common coating methods include electroplating, chemical plating, and magnetron sputtering.
Advanced Institute (Shenzhen) Technology Co., LtdIn the study, it was found that electroless plating can form a uniform nickel layer on the surface of PEN film, and the process conditions are relatively mild, suitable for large-scale production. Magnetron sputtering can precisely control the thickness and composition of the coating, but the equipment cost is relatively high. Different coating processes can result in different microstructures and surface roughness of the coating, thereby affecting its conductivity.
（3） Microstructure of coating
The microstructure of the nickel layer, such as grain size and grain boundary density, has a significant impact on its conductivity. Thin grain structured coatings typically have higher electrical resistivity because grain boundaries hinder electron transport. By optimizing the coating process, the grain growth of the nickel layer can be controlled, thereby reducing the resistivity. For example, Advanced Institute (Shenzhen) Technology Co., Ltd. successfully prepared a nickel layer with uniform grain size and low grain boundary density by adjusting the composition and deposition parameters of the plating solution, significantly improving the conductivity of PEN nickel plating film.
（4） Environmental factors
The conductivity of PEN nickel plating film is also affected by environmental factors. For example, in high humidity environments, the nickel layer may undergo oxidation reactions, leading to an increase in resistance. In addition, temperature changes can also affect the conductivity of the nickel layer. Advanced Institute (Shenzhen) Technology Co., Ltd. has effectively improved the oxidation resistance and moisture resistance of the nickel plating film by adding a protective layer, such as a nano oxide coating, on the surface of the nickel layer, thereby ensuring its stable conductivity in different environments.
3、 Research achievements of Advanced Institute (Shenzhen) Technology Co., Ltd
Advanced Institute (Shenzhen) Technology Co., Ltd
PEN thin film nickel plating technologySignificant progress has been made in this regard. The company has developed a new chemical plating process that can form a uniform and dense nickel layer on the surface of PEN film. By optimizing the plating solution formula and deposition conditions, precise control of coating thickness has been successfully achieved, and surface resistance has been significantly reduced. In addition, the company has further improved the oxidation resistance and environmental adaptability of nickel plating films through surface modification technology. These research results provide strong support for the application of PEN nickel plating film in flexible electronic devices.
4、 Summary
The nickel plating layer on PEN film has broad application prospects in the field of flexible electronics due to its excellent conductivity and good mechanical stability. Its conductivity is influenced by a combination of coating thickness, coating process, microstructure, and environmental factors. Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully solved the challenges brought by these influencing factors through technological innovation and developed high-performance PEN nickel plating film. In the future, with the continuous development of flexible electronic technology, PEN nickel plating film is expected to achieve breakthroughs in more fields, providing new solutions for the lightweighting, flexibility, and high performance of electronic devices.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
