In the field of electronic packaging, aluminum oxide substrates are widely used due to their excellent insulation, high thermal conductivity, and good mechanical properties. As a key material for achieving internal circuit interconnection on substrates, the adhesion and conductivity of hole filling gold paste in through holes on alumina substrates play a decisive role in the performance and reliability of electronic devices. Advanced Institute (Shenzhen) Technology Co., Ltd
electronic pasteSignificant achievements have been made in research and development innovation.
1、 Composition and function of filling gold paste
The filling gold paste consists of a conductive phase, a bonding phase, and an organic carrier. The conductive phase is generally used
High purity gold powderEnsure excellent conductivity performance. The bonding phase is mostly glass powder, which undergoes physical and chemical reactions with the surface of the alumina substrate during sintering, determining the adhesion between the gold paste and the substrate. Organic carriers endow gold paste with good rheological properties, making it convenient to fill through holes during printing.
2、 Factors affecting performance
（1） Ingredients of gold paste
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Conductive phase: The particle size and shape of gold powder have a significant impact. The combination of gold powder with different particle sizes can balance adhesion and conductivity. For example, large particle size gold powder has a high packing density, while small particle size gold powder has high sintering activity. Mixing them in appropriate proportions can optimize their performance.
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Adhesive phase: The composition and content of glass powder are crucial. Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB8106 filling gold pasteBy optimizing the formula of glass powder, the adhesion with the substrate has been enhanced, and it also has a positive impact on the formation and stability of conductive pathways.
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Organic carrier: Its volatilization characteristics affect the morphology of gold paste. Volatile too quickly, the gold paste is prone to drying and cracking, and the adhesion decreases; If the volatilization is too slow, pores will be generated during sintering, which will affect the conductivity. Therefore, it is crucial to choose organic carriers with moderate volatilization rates and good compatibility.
（2） Process parameters
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Printing parameters: The pressure, scraper angle, and speed during printing determine the uniformity and density of the gold paste filling. Appropriate parameter settings can evenly fill the through holes with slurry, laying the foundation for subsequent performance.
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Sintering parameters: Improper control of sintering temperature and time can affect the bonding and conductivity between the gold paste and the substrate. Advanced Institute (Shenzhen) Technology Co., Ltd. suggests that specific products can adopt a sintering process of low-temperature heating, insulation, and then heating to a suitable temperature to achieve good results.
3、 Methods to improve performance
（1） Optimize the formula for gold paste
Adjust the ratio and type of gold powder, glass powder, and organic carrier through experiments. The use of a composite glass powder system can further enhance the performance of the gold paste.
Advanced Institute (Shenzhen) Technology Co., LtdContinuously optimize the formula to meet the needs of different application scenarios.
（2） Improve process control
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Printing process: High precision printing equipment is used, combined with an online monitoring system, to accurately control and adjust printing parameters in a timely manner, ensuring the filling effect of the gold paste.
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Sintering process: A precise temperature controlled sintering furnace is used, and a segmented sintering process is adopted to promote the full reaction between the gold paste and the substrate, improve adhesion and conductivity.
4、 Product advantages of Advanced Institute (Shenzhen) Technology Co., Ltd
Advanced Institute (Shenzhen) Technology Co., Ltd.'s YB8106 pore filling gold paste has obvious advantages. High purity gold powder ensures excellent conductivity, unique formula and system for better filling effect, and strict process control ensures stable and reliable product quality.
To improve the adhesion and conductivity of through-hole filling gold paste on alumina substrates, efforts need to be made from multiple aspects such as optimizing the gold paste formula and controlling the process. Advanced Institute (Shenzhen) Technology Co., Ltd. provides strong support for the development of the electronics industry with its professional research and development capabilities and high-quality products, promoting the continuous improvement of the performance of hole filling gold paste and assisting the continuous development of electronic devices.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
