The influence of thermal conductivity and electrical conductivity of pressure sintered silver paste on device performance

Pressure sintered silver pasteAs a special paste material containing high-purity silver powder, it is prepared by adding appropriate amounts of binders, solvents, and additives through specific processes. It has been widely used in the field of microelectronic packaging, especially with significant advantages in improving device performance. This article will explore how the thermal conductivity and electrical conductivity of pressure sintered silver paste affect device performance, and compare and analyze relevant and experimental data. It will also mention Advanced Institute (Shenzhen) Technology Co., Ltd. and itsYanbo brand silver paste.

The Influence of Thermal Conductivity on Device Performance

Thermal conductivity is an important parameter for measuring the thermal conductivity of materials. In power electronic devices, heat dissipation has become increasingly important due to the increase in power density. Pressure sintered silver paste has high thermal conductivity, which can effectively reduce the operating temperature of the device, thereby improving the stability and reliability of the device.

According to experimental data,Sintered silverThe thermal conductivity of is 220W/m/K, while the thermal conductivity of pure silver is 417W/m/K. Although the thermal conductivity of sintered silver is slightly lower than that of pure silver, its performance still far exceeds that of traditional solder alloys. For example, the thermal conductivity of solder paste after sintering is approximately 3-5 times that of high-quality solder alloys or conductive adhesives. This means that devices using pressure sintered silver paste can dissipate heat more effectively, reduce thermal stress, and extend their service life.

The research platinum brand silver paste from Advanced Institute (Shenzhen) Technology Co., Ltd. has shown excellent performance in terms of thermal conductivity. Its low-temperature sintering technology can achieve high thermal conductivity connections without applying external pressure, simplifying production processes and reducing costs. For example,Low temperature sintering nano silver pasteIt can be sintered and bonded at a minimum temperature of 150 ° C, and maintain high thermal conductivity even after recovering to the inherent melting point of silver (about 961 ° C).

The Influence of Conductivity on Device Performance

Conductivity is a parameter that measures the electrical conductivity of a material. In power electronic devices, high conductivity means low resistance, which can reduce power loss and improve device efficiency. Pressure sintered silver paste, due to its high purity silver powder content, has high electrical conductivity, making the device perform well under high-frequency and high-power conditions.

Experimental data shows that the resistivity of sintered silver is 4 × 10-6 Ω· cm. Although sintered silver has a slightly higher electrical resistivity than pure silver, its performance is still superior to traditional solder alloys. The conductivity of the sintered solder paste is approximately 3-5 times that of high-quality solder alloys or conductive adhesives. This means that devices using pressure sintered silver paste have lower resistance, can reduce power loss, and improve energy efficiency.

Advanced Institute (Shenzhen) Technology Co., LtdThe research platinum brand silver paste also performs well in terms of conductivity. The pressure sintered silver paste uses pressure sintering technology to form a tight metal connection layer between silver particles, which has excellent conductivity. In addition, this technology can significantly reduce the thickness of the sintering layer, improve thermal conductivity, and enable the device to perform well under high-frequency and high-power conditions.

Data comparison and analysis

The following is a comparison of thermal conductivity and electrical conductivity data between pressure sintered silver paste and traditional solder alloys:

From the data comparison, it can be seen that pressure sintered silver paste is superior to traditional solder alloys in terms of thermal conductivity and electrical conductivityConductive adhesiveThis gives devices using pressure sintered silver paste significant advantages in terms of heat dissipation performance and energy utilization efficiency.

conclusion

Pressure sintered silver paste has been widely used in the field of microelectronic packaging due to its high thermal conductivity and electrical conductivity. By using pressure sintered silver paste, the heat dissipation performance and energy utilization efficiency of the device can be significantly improved, the service life can be extended, and stability and reliability can be improved. The research platinum brand silver paste of Advanced Institute (Shenzhen) Technology Co., Ltd. has shown excellent performance in thermal conductivity and electrical conductivity, providing high-quality solutions for the packaging of power electronic devices.

With the continuous advancement of technology and the expansion of application fields, pressure sintered silver paste will play a more important role in the future electronic world. By continuously optimizing the preparation process and performance parameters, pressure sintered silver paste will make a greater contribution to achieving more efficient and reliable packaging of power electronic devices.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.