How to improve the sintering density of low-temperature sintered solder copper paste?

In the modern electronic manufacturing industry, low-temperature sintered solder copper paste is widely used in integrated circuits, chip packaging, flexible circuit boards, and other fields due to its ability to achieve rapid sintering at lower temperatures while maintaining good conductivity and mechanical properties. However, the sintering density of low-temperature sintered solder copper paste is one of the key factors affecting its performance. Improving sintering density can not only enhance the conductivity and mechanical strength of materials, but also improve the reliability and stability of products. This article will explore how to improve the sintering density of low-temperature sintered solder copper paste, and focus on the research and development of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB1099 Low Temperature Sintering Solder Copper PasteInnovative practices in improving sintering density.

1、 Key factors for improving the sintering density of low-temperature sintered solder copper paste

1.1 Raw material selection and proportioning

The raw materials for low-temperature sintered solder copper paste mainly include solder powder, copper powder, additives, and carriers. Solder powder provides conductivity and solderability, copper powder enhances thermal conductivity and mechanical strength, and additives are used to adjust sintering performance, improve wettability, etc. The selection and ratio of raw materials have a significant impact on the sintering density.

• The ratio of solder powder to copper powder: The appropriate ratio can achieve the best sintering effect and conductivity. Excessive solder powder may cause the sintered layer to become loose, while excessive copper powder may affect the fluidity of the solder, leading to incomplete sintering.
• Types and dosages of additives: Appropriate amounts of flux, antioxidants, and other additives can improve the wettability of the sintering interface, reduce porosity and defects during the sintering process, and thus increase the sintering density.

1.2 Sintering process optimization

Sintering process is an important means of controlling sintering density. By optimizing parameters such as sintering temperature, time, and atmosphere, densification of the sintered layer can be achieved.

• Sintering temperature: Sintering temperature is a key factor affecting sintering density. The temperature is too low, and the solder powder and copper powder cannot fully melt and bond, resulting in a loose sintered layer; If the temperature is too high, it may lead to excessive sintering, resulting in cracks and deformation. Therefore, it is necessary to choose an appropriate sintering temperature to ensure that the solder powder and copper powder can fully melt and bond, forming a dense sintering layer.
• Sintering time: The length of sintering time also affects the sintering density. A too short sintering time may lead to incomplete sintering, while a too long time may cause excessive sintering or thermal decomposition. Therefore, it is necessary to determine the appropriate sintering time based on the sintering temperature and raw material characteristics.
• Sintering atmosphere: The sintering atmosphere also has a significant impact on the sintering density. Usually, an inert or reducing atmosphere can protect solder powder and copper powder from oxidation, thereby increasing sintering density.

1.3 Equipment and Process Control

Advanced sintering equipment and precise process control are also important guarantees for improving sintering density. By adopting high-precision temperature control systems, atmosphere control systems, etc., it is possible to ensure precise controllability of parameters such as temperature, time, and atmosphere during the sintering process, thereby improving the sintering density.

2、 Innovative Practice of YB1099 Low Temperature Sintering Solder Copper Paste from Yanbo Brand

Developed by Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB1099 Low Temperature Sintering Solder Copper PasteMultiple innovative practices have been carried out in improving sintering density.

2.1 Raw material selection and ratio optimization

The YB1099 low-temperature sintering solder copper paste from Yanbo brand uses high-purity and low oxygen content solder powder and copper powder, which are carefully proportioned to ensure that the solder powder and copper powder can fully melt and bond during the sintering process, forming a dense sintering layer. At the same time, the copper paste also added self-developed flux and antioxidant additives, effectively improving the wettability of the sintering interface and reducing porosity and defects during the sintering process.

2.2 Sintering process optimization

The sintering process of YB1099 low-temperature sintered solder copper paste from Yanbo brand has been carefully optimized. By adopting high-precision temperature control system and atmosphere control system, the precise controllability of temperature, time, atmosphere and other parameters during the sintering process is ensured. At the same time, the copper paste also uses unique sintering additives to further improve the sintering density.

2.3 Equipment and Process Control

Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB1099 Low Temperature Sintering Solder Copper PasteEquipped with advanced sintering equipment and precise process control system. These devices can precisely control various parameters during the sintering process, ensuring the density and uniformity of the sintered layer. At the same time, the company has established a strict quality management system to strictly control every aspect of the production process, ensuring stable and reliable product quality.

3、 Conclusion

Improving the sintering density of low-temperature sintered solder copper paste is the key to ensuring its performance. By optimizing raw material selection and ratio, sintering process optimization, and adopting advanced equipment and process control measures, the sintering density can be effectively improved, thereby enhancing the conductivity and mechanical strength of the material, and improving the reliability and stability of the product. The YB1099 low-temperature sintered solder copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. has achieved significant results in this field, providing strong support for the development of the electronic manufacturing industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.