Application of ultrafine gold powder in electronic pastes: strategies to improve its stability

With the rapid development of electronic technology, the application of electronic paste in fields such as electronic packaging and printed circuit board (PCB) manufacturing is becoming increasingly widespread. Among them, gold powder, as a key conductive material, plays a crucial role in the conductivity and stability of electronic pastes.Ultra fine gold powderDue to its excellent conductivity and good dispersibility, it has become an ideal choice for preparing high-performance electronic pastes. However, in practical applications, the stability of ultrafine gold powder in electronic slurries has always been a key factor restricting its widespread application. This article will explore the application of ultrafine gold powder in electronic pastes and propose strategies to improve its stability.

The application advantages of ultrafine gold powder in electronic pastes

1. Excellent conductivity

Ultra fine gold powder has small particle size and short electron transmission path, thus possessing excellent conductivity. This enables electronic pastes made from ultrafine gold powder to achieve more efficient electronic transfer and improve the performance of electronic products.

2. Good dispersibility

Ultra fine gold powder has a large specific surface area and high surface energy, making it easier to uniformly disperse in electronic pastes. Good dispersibility helps to reduce the agglomeration of gold powder particles and improve the uniformity and stability of electronic pastes.

3. Improve the performance of electronic paste

The addition of ultrafine gold powder can significantly improve the conductivity, wear resistance, corrosion resistance, and other properties of electronic pastes, thereby meeting the requirements of high-precision and high-performance electronic products.

Stability issues of ultrafine gold powder in electronic pastes

Although ultrafine gold powder iselectronic pasteChina has many advantages, but its stability has always been a key factor restricting its widespread application. Ultra fine gold powder is prone to agglomeration in electronic pastes, leading to a decrease in the conductivity and stability of the electronic paste. In addition, ultrafine gold powder is prone to react with other components in the electronic paste, further affecting the performance of the electronic paste.

Strategies for improving the stability of ultrafine gold powder in electronic slurries

1. Optimize the size and distribution of gold powder particles

By controlling the size and distribution of gold powder particles, the agglomeration phenomenon of gold powder particles can be reduced, and their stability in electronic slurries can be improved. For example, the ultrafine gold powder prepared by ball milling, spray drying and other methods has more uniform particle size and distribution, which helps to improve the stability of electronic paste.

2. Choose the appropriate dispersant

Adding appropriate dispersants to electronic pastes can effectively prevent the agglomeration of ultrafine gold powder and improve its dispersibility and stability. The selection of dispersants should consider their compatibility with gold powder particles, dispersion effect, and impact on other properties of electronic pastes.

3. Control the pH value and viscosity of electronic paste

The pH value and viscosity of electronic pasteUltra fine gold powderThe stability has a significant impact. By adjusting the pH and viscosity of the electronic paste, the dispersion state of gold powder particles in the paste can be optimized, reducing the occurrence of agglomeration and thus improving the stability of the electronic paste.

4. Adopting advanced preparation techniques

By adopting advanced preparation techniques such as ultrasonic dispersion and high-pressure homogenization, the stability of ultrafine gold powder in electronic slurries can be further improved. These processes can effectively disrupt the agglomeration structure between gold powder particles and achieve more uniform dispersion.

5. Strictly control storage conditions

The stability of ultrafine gold powder in electronic pastes is also affected by storage conditions. The temperature, humidity, and other factors of the storage environment should be strictly controlled to avoid agglomeration or deterioration of gold powder particles due to moisture, oxidation, and other reasons.

conclusion

Ultra fine gold powder inelectronic pasteThe application of this technology has broad prospects, but its stability has always been a key factor restricting its widespread use. By optimizing the size and distribution of gold powder particles, selecting appropriate dispersants, controlling the pH and viscosity of electronic slurries, adopting advanced preparation processes, and strictly controlling storage conditions, the stability of ultrafine gold powder in electronic slurries can be effectively improved, promoting its widespread application in the field of electronics. With the continuous advancement of technology and innovation in preparation techniques, it is believed that the application of ultrafine gold powder in electronic pastes will become more extensive and in-depth.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.