In the field of electronic packaging, the bonding effect of surface bonding alloy paste directly affects the performance and reliability of electronic devices. And environmental humidity, as a key factor, has an undeniable impact on its bonding effect. Advanced Institute (Shenzhen) Technology Co., Ltd. has long been committed to the research and development of electronic pastes
Research Platinum Brand Surface Bond Alloy SlurryIt has a good reputation in the market and its bonding performance under different humidity conditions has also received much attention.
The influence of humidity on the solidification process of bond alloy slurry
The solidification of bond alloy slurry is a key step in forming good bonds. In environments with high humidity, water vapor molecules can interfere with the volatilization and cross-linking reactions of organic components in gold paste. For example, the organic carrier in gold paste usually needs to evaporate at a certain temperature to promote the tight packing of metal particles and achieve solidification. However, under high humidity, water vapor forms a water film on the surface of the gold paste, hindering the normal evaporation of organic carriers and slowing down the curing rate. Taking the surface bonding alloy slurry of Yanbo brand as an example, when the relative humidity exceeds 60%, the curing time is extended by about 20% -30% compared to low humidity environment, and the density of the film layer decreases after curing, resulting in more small pores, which will seriously affect the bonding strength.
The impact on bonding strength
Humidity can alter the interfacial adhesion between the gold paste and the substrate. When the humidity is low, the active ingredients in the gold paste can react well with atoms or functional groups on the surface of substrates such as alumina, forming strong chemical bonds. However, as the humidity increases, water vapor will adsorb onto the substrate surface, hindering direct contact between the gold paste and the substrate and hindering the formation of chemical bonds. Research has shown that during the process of increasing relative humidity from 30% to 80%,
Research Platinum Brand Surface Bond Alloy SlurryThe bonding strength with the alumina substrate can be reduced by about 30% -40%. This is because the weak bonding layer formed by water vapor at the interface is prone to damage under external forces, leading to bond failure.
The impact on conductivity performance
The conductivity of bonding is also significantly affected by humidity. In low humidity environments, the continuous conductive path formed by the solidification of gold paste is good, and electrons can be transmitted smoothly. But in high humidity environments, on the one hand, the pores generated by insufficient solidification of the gold paste will increase electron scattering and increase resistance; On the other hand, water vapor may cause oxidation of metal particles in the gold paste, especially trace impurities on the gold surface, which are more easily oxidized under the action of water vapor. The appearance of an oxide layer seriously hinders electron conduction. Testing the surface bonding alloy slurry of the research platinum brand revealed that as humidity increases, the resistance value of the bonding point can increase several times, seriously affecting the signal transmission and power loss of electronic devices.
Response Plan of Advanced Institute (Shenzhen) Technology Co., Ltd
In order to reduce the influence of humidity on the bonding effect,
Advanced Institute (Shenzhen) Technology Co., LtdStarting from both the formula and process of gold paste. In terms of formula, optimize the organic carrier and additive system to enhance the moisture resistance of the gold paste, such as adding special moisture inhibitors, so that the gold paste can maintain a relatively stable curing speed and performance in high humidity environments. In terms of process, it is recommended that customers perform pre drying treatment on the substrate and gold paste before bonding, strictly control the environmental humidity in the bonding workshop within a suitable range of 30% -50%, and optimize the curing process parameters, such as appropriately increasing the curing temperature and extending the insulation time, to ensure that the gold paste is fully cured and improve the bonding effect.
The environmental humidity has a significant impact on the bonding effect of surface bonding alloy slurry, including curing process, bonding strength, and conductivity. Advanced Institute (Shenzhen) Technology Co., Ltd. has continuously developed and innovated to provide customers with more suitable surface bonding alloy slurries and application solutions for different humidity environments, helping the electronic packaging industry improve product quality and performance. In actual production, strict control of humidity and reasonable selection of gold paste and process are the key to ensuring the bonding effect.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
