How does the composition of pressure sintered silver paste affect its sintering effect

Pressure sintered silver pasteIt is an efficient and reliable electronic packaging material widely used in the electronics industry. It is prepared by adding appropriate amounts of adhesives, solvents, and additives through a specific process, and maintains a paste state at room temperature for easy coating or dispensing. At a certain temperature and pressure, silver powder particles will sinter to form a highly conductive and high-strength metal connection layer. This article will delve into the composition of pressure sintered silver paste, especially the silver powder particle size and binder, and how they affect its sintering effect, and compare and analyze them with relevant data and experiments.

The influence of silver powder particle size

The particle size of silver powder is one of the key factors affecting the sintering effect in pressure sintered silver paste. Different particle sizes of silver powder have a significant impact on sintering temperature, sintering density, and conductivity.

• A-class silver paste: made of polyethylene glycol coated nano silver powder, with a solid content of 94%, and the decomposition temperature of the coating layer is at 230 ℃ and 311 ℃. Research has shown that the volatilization of organic components in sample A is relatively complete after sintering, resulting in a high density and shear strength of the sintered structure.
• B-class silver paste: made of oil amine coated nano silver powder, with a solid content of 88%, and the decomposition temperature of the coating layer is 360 ℃. Although in sample BNano silver particlesThe particle size is small, but the excessively high decomposition temperature of organic matter results in an insufficiently dense sintered structure and low shear strength.
• C-type silver paste: made of nano silver powder coated with myristic acid, with a solid content of 67%, and the decomposition temperature of the coating layer is 174 ℃. The organic component content in sample C is too high, which affects the sintering performance and leads to a decrease in the performance of the sintered joint, resulting in low shear strength.

The influence of adhesives

Adhesive plays a crucial role in the sintering process, not only affecting the coating performance of silver paste, but also directly affecting the conductivity and strength after sintering.

• Experimental data comparison: Under the same sintering conditions, there are significant differences in the sintering effect of silver paste prepared using different adhesives. For example, silver paste prepared using a specific adhesive exhibits higher conductivity and strength after sintering. This is mainly because suitable adhesives help to form tighter silver particle connections during the sintering process, thereby improving sintering density and conductivity.

Advanced Institute (Shenzhen) Technology Co., Ltd. and Research Platinum Silver Paste

Advanced Institute (Shenzhen) Technology Co., Ltd., as a leader in the field of electronic materials, enjoys a high reputation in the industry for its research and development of platinum brand silver paste.Yanbo brand silver pasteBy adopting advanced preparation techniques and high-quality raw materials, the high performance and stability of the silver paste are ensured.

• Data comparison: Taking the research platinum brand silver paste as an example, the thermal conductivity of its sintered sample at 25 ℃ is 367.90 W/m · K, reaching 87.8% of the thermal conductivity of pure silver. In the conductivity test, the average resistance of sintered silver foil prepared using Yanbo brand silver paste is 562.6 μ Ω, which is much lower than the resistance values of other brands of silver paste.

Experimental data analysis

In order to more intuitively demonstrate the influence of silver paste composition on sintering effect, the following experiments were conducted:

• Experiment 1: Prepare silver paste using silver powder of different particle sizes and sinter it under the same sintering conditions. By observing the sintered microstructure through scanning electron microscopy, it was found that silver powder with smaller particle size had a denser structure after sintering, but excessively high organic decomposition temperature could lead to a decrease in sintering performance.
• Experiment 2: Silver paste was prepared using different adhesives and sintered under the same sintering conditions. By measuring the conductivity and strength after sintering, it was found that silver paste using a specific adhesive exhibited higher conductivity and strength.

conclusion

in summary,Pressure sintered silver pasteThe composition has a significant impact on its sintering effect. The selection of silver powder particle size and binder is a key factor affecting sintering performance. By optimizing the particle size of silver powder and selecting appropriate binders, the sintering density, conductivity, and strength of silver paste can be significantly improved. The research platinum brand silver paste of Advanced Institute (Shenzhen) Technology Co., Ltd. has achieved significant results in this area, providing high-performance and reliable electronic packaging materials for the electronics industry.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.